The Ryzen 7000 Delid-Die-Mate is a tool to safely delid the Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled via Direct Die, for example. With the Direct Die, the CPU cooler is mounted directly on the CPU chiplets and the I/O die, which enables a significantly optimised heat transfer. VOIDS WARRANTY When delidding your CPU you void your warranty - using this Delid-Die-Mate tool at your own risk

3.1 GHz, 16-core, 32 trådar, 45 MB cache, FCLGA4677 Socket, Box

CPU-kylare, luft kylare, kompatibel med AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, ljudnivå: max 29 dBA, luftflöde: max 66.47 CFM, statiskt tryck: max 2.04 mmH₂O, RPM fläkt: 500 - 1850 ± 10%, PWM-kontrollerad, 4-pins PWM förbindelse, 1 x 120mm fläkt, 4 heatpipes, kylare höjd: 155mm, inklusive kylpasta, färg vit (kontrollerad av ASUS AURA / Asrock PolyChrome Sync / Gigabyte RGB Fusion 2.0 / MSI Mystic Light Sync)

3.9 GHz, med 8 kärnor, 16 trådar, 35.75 MB cache, LGA3647 Socket, OEM

USFF, UCFF, USB/ljud

CPU-kylare, vattenkylningssystem, kompatibel med AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, fläkt ljudnivå: 10 - 37 dBA, RPM fläkt: 480 - 2400 ± 10%, fläkt CFM: 16.44 - 63.1, statiskt tryck: 0.17 - 3.8 mmH₂O, PWM-kontrollerad, 277mm radiator med 2 x 120mm RGB Fläktar, 4-pins PWM & 3-pins ARGB förbindelse, inklusive kylpasta, inbyggd skärm, svart med RGB (kontrollerad av: Corsair iCUE)-With integrated LCD screen. controlled by Corsair iCUE LINK -Quiet Operation with Magnetic Dome Bearing -Supports Zero RPM Mode & Smart Fan Curves with iCUE LINK

Processor (CPU), 3.6 GHz (3.9 GHz Turbo), 4 kärnor (Quad Core), 8 trådar, 8.25 MB cache, LGA2066 Socket, 120 watt TDP, Bulk (utan kylare)

Moderkort, storlek: ATX, Intel LGA1851 socket, Intel B860 chipset, 1 x PCI-Express 5.0 x16, Dual DDR5-5600 4 x DIMM slots (Intel XMP support), lagringsportar: 4 x SATA-600 / 2 x M.2 NVMe PCI-Express 4.0 / 1 x M.2 NVMe PCI-Express 5.0 (M.2 size: 2242 / 2260 / 2280), USB 3.2 Gen 2x2 type A & C, skärmanslutning: 1 x Displayport 1.4 / 1 x HDMI 2.1, Realtek RTL8125BG 2.5 Gigabit nätverk (LAN), Intel Xe Graphics stöds (CPU med VGA krävs), Realtek ALC897 HD Audio (8-kanaler) ljudkort, ASRock Polychrome SYNC software

CPU-kylare, luft kylare, kompatibel med AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851 / LGA2011 / LGA2011-V2 / LGA2066 / , ljudnivå: 19.2 dBA - 24.6 dBA, luftflöde: 68 - 82.5 CFM, statiskt tryck: 1.51 - 2.08 mmH₂O, RPM fläkt: 300 - 1500 ± 10%, PWM-kontrollerad, 4-pins PWM förbindelse, 2 x 140mm Fläktar, 6 heatpipes, kylare höjd: 165mm, inklusive kylpasta, färg brun / beige / silver

CPU-kylare, vattenkylningssystem, kompatibel med AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, fläkt ljudnivå: 15.4 - 33.8 dBA, RPM fläkt: - max 1800 ± 10%, PWM-kontrollerad, 317mm radiator med 2 x 140mm Fläktar, 4-pins PWM & 3-pins ARGB förbindelse, inklusive kylpasta, svart med RGB (kontrollerad av: ASUS AURA / Asrock Polychrome Sync / Gigabyte Fusion / MSI Mystic Light)-

Moderkort, ATX, Intel LGA1700 Socket, Intel Z790, 1 x PCI-Express 5.0 x16 & 1 x PCI-Express 4.0 x16, Dual DDR5-5600 - 4 x DIMM slots, 4 x SATA-600 / 3 x M.2 NVMe PCI-Express 4.0 (2242 / 2260 / 2280), USB 3.2 Gen 2 Type A & C, 2 x HDMI 2.1 förbindelse, Realtek RTL8125BG 2.5 Gigabit LAN, WiFi 6E (802.11ax) & Bluetooth 5.3, Intel Xe Graphics stöd (CPU krävs), Realtek ALC1220 HD Audio (8-kanaler)

Processor (CPU), 3.5 GHz (4.7 GHz Turbo), 4 kärnor (quad core) / 4 P-kärnor / 0 E-kärnor, 8 trådar, 5 MB L2 / 12 MB L3 cache, stödjer Dual Channel 3200-DDR4 RAM / 4800-DDR5 RAM, 20 PCI Express Gen 5.0 lanes, LGA1700 socket, inbyggt Intel Graphics UHD 730 grafikkort, 125 watt TDP / 60 watt PBP / 110 watt PBP, Box med INTEL RM1 kylare - Intel Raptor Lake-S Stöds av moderkort med Z790 / B760-chipset, samt Z690 / B660-chipset som dock kan kräva en BIOS-uppdatering

Kylsystem med vätska till processorn, Elementstorlek: 360 mm, (för: LGA1150, LGA1151, LGA1155, LGA1156, LGA1200, LGA1700, LGA2011, LGA2011-3, LGA2066, AM4, TR4, AM5), koppar, 120 mm

Processorkylare, (för: SP3, sTR4, sTRX4, sWRX8), aluminiumfenor, 140 mm, grå

Processorkylare, (för: LGA1156, LGA1155, LGA2011, LGA1150, LGA2011-3, LGA1151, AM4, LGA2066, LGA1200, LGA1700, AM5), aluminium, 140 mm

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules. Excellent thermal conductivity High compressibility Easy to use Electrically non-conductive Comparison of the Minus Pad Basic-, Advance-, and Pro series: Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio. Minus Pad Advance: Improved thermal conductivity, higher compressibility. Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility - at a slightly higher Price.